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comparison of two sensors
New event-based vision sensors
Sony to release two types of stacked event-based vision sensors with the industry’s smallest*1 4.86 micrometre pixel size for detecting subject changes only
09 Sep, 2021
Atsugi, Japan — Sony Semiconductor Solutions Corporation (“Sony”) today announced the upcoming release of two types of stacked event-based vision sensors. These sensors designed for industrial equipment are capable of detecting only subject changes, and achieve the industry’s smallest*1 pixel size of 4.86μm.
ToF depth sensor stacked configuration
New industry first sensor
Sony to release a stacked SPAD depth sensor for automotive LiDAR applications, an industry first
06 Sep, 2021
Atsugi, Japan — Sony Semiconductor Solutions Corporation today announced the upcoming release of the IMX459 stacked SPAD depth sensor for automotive LiDAR applications using direct Time-of-Flight (dToF) method, an industry first.
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